GCSP-017-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-025-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-017-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-025-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-040-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-040-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
Pyrolytic Graphite Thermal Interface Material. Graphite Heat Spreader. Offers an ideal thermal management solution for applications where limited space is available and custom shapes are required.T...
GCSP-012-G is a high performance thermal interface graphite pad with high thermal conductivity and flexibility. This thin graphite pad allows for easy attachment of heat sinks or other thermal comp...
GCSP-017-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-025-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-040-G is a high performance thermal interface graphite pad. This thin graphite pad allows for easy attachment of heat sinks or other thermal components in a limited space.15W/m K thermal condu...
GCSP-050-G is a high performance thermal interface graphite pad with high thermal conductivity and flexibility. This thin graphite pad allows for easy attachment of heat sinks or other thermal comp...
GCSP-070-G is a high performance thermal interface graphite pad with high thermal conductivity and flexibility. This thin graphite pad allows for easy attachment of heat sinks or other thermal comp...
GCSP-100-G is a high performance thermal interface graphite pad with high thermal conductivity and flexibility. This thin graphite pad allows for easy attachment of heat sinks or other thermal comp...
UL. T-flex 600 ; 6000. T-flex 600 Series™ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boro...
UL. T-flex 600 ; 6000. T-flex 600 Series™ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boro...
T-flex 300 ; 3000. T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 5...
UL. T-flex 600 ; 6000. T-flex 600 Series™ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boro...
T-flex 300 ; 3000. T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 5...
UL. T-flex 600 ; 6000. T-flex 600 Series™ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boro...
UL. T-flex 600 ; 6000. T-flex 600 Series™ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boro...