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MOLEX 173112-1067 D-SUB CONTACT, SOCKET, CRIMP (1 offer) Contact Plating Gold Plated Contacts For Use With Molex Mixed Layout D-Sub Connectors Product Range 173112 Contact Material Copper Alloy Wire Size AWG Max - Wire Size AWG Min - Contact Termination ... |
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HPE Xeon E7-8837 processor 2.66 GHz 24 MB L3 (1 offer) Intel's latest-generation microarchitecture represents the next step in unprecedented processor performance and dynamic scalability. Designed from the ground up to take advantage of hafnium-based I... |
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