| | | | | |
| Picture | | | | Order |
|
|
98% |
|
Qoltec 51636 heat sink compound (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 1.57* per piece |
|
98% |
|
Qoltec 51637 heat sink compound (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 2.74* per piece |
|
98% |
|
Qoltec 51638 heat sink compound (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 3.18* per piece |
|
98% |
|
Qoltec 51640 heat sink compound (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 1.40* per piece |
|
98% |
|
Qoltec 51641 heat sink compound 3.05 W/m·K 0.5 g (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 0.93* per piece |
|
98% |
|
Qoltec 51644 heat sink compound 3.05 W/m·K 100 g (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 14.60* per piece |
|
98% |
|
Qoltec 51646 heat sink compound 3.17 W/m·K 0.5 g (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 1.23* per piece |
|
98% |
|
|
noctua NT-H1 3.5G AM5 EDITION |
from £ 9.24* per piece |
|
98% |
|
Qoltec 51647 heat sink compound 3.17 W/m·K 5 g (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 3.75* per piece |
|
98% |
|
|
noctua NT-H2 3.5G AM5 EDITION |
from £ 11.60* per piece |
|
98% |
|
Qoltec 51651 heat sink compound 4.63 W/m·K 0.5 g (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 1.31* per piece |
|
98% |
|
|
|
from £ 12.85* per piece |
|
98% |
|
Qoltec 51655 heat sink compound 5.15 W/m·K 1 g (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 1.90* per piece |
|
98% |
|
Qoltec 51656 heat sink compound 5.15 W/m·K 5 g (2 offers) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 6.87* per piece |
|
98% |
|
Qoltec 51658 heat sink compound 11 W/m·K 2 g (1 offer) Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ... |
|
from £ 12.38* per piece |
|
|