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Item
TE Connectivity AMPMODU MTE Series Straight Through Hole PCB Header, 7 Contact(s), 2.54mm Pitch, 1 Row(s), Shrouded / 8411186
Quantity:
packet
Product information
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Item number:
2794E-8411186
Manufacturer:
TE Connectivity
Manufacturer no.:
5-104809-6
EAN/GTIN:
5059040306653
Search terms:
Pin header
pin header
TE Connectivity AMPMODU MTE 2.54mm SMT Compatible High-Temperature Headers with Hold Down Posts. AMPMODU MTE single row shrouded high temperature headers with a 2.54mm pitch and hold down posts / swage tail feature that helps to prevent the connector from moving prior to flow soldering. The housings of these AMPMODU MTE headers are made from high temperature UL 94V-0 thermoplastic and are SMT compatible. Additional features of these 2.54mm AMPMODU MTE PCB mount shrouded headers are an integral latch which provides positive retention between the header connector and the receptacle housing and PCB orientation. These AMPMODU high temperature SMT compatible headers have 0.64mm square posts with gold plating on contact area.
More information:
Series:
AMPMODU MTE
Pitch:
2.54mm
Number of Contacts:
7
Number of Rows:
1
Body Orientation:
Straight
Shrouded/Unshrouded:
Shrouded
Connector System:
Wire to Board
Mounting Type:
Through Hole
Termination Method:
Solder
Contact Material:
Brass
Contact Plating:
Gold
Current Rating:
3.0A
... >
Connectors
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PCB Connectors & Wire Housings
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PCB Headers
Other search terms:
8411186
,
Connectors
,
PCB Connectors & Wire Housings
,
PCB Headers
,
TE Connectivity
,
51048096
An overview of the conditions
1
Delivery period
Stock level
Price
from £ 16.175*
Price is valid from 3,000 packets
1 packet contains 5 pieces (from £ 3.235* per piece)
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Staggered prices
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Net
Gross
Unit
1 packet
£ 19.145*
£ 22.974
per packet
from 2 packets
£ 18.965*
£ 22.758
per packet
from 5 packets
£ 18.005*
£ 21.606
per packet
from 10 packets
£ 17.525*
£ 21.03
per packet
from 20 packets
£ 17.165*
£ 20.598
per packet
from 3000 packets
£ 16.175*
£ 19.41
per packet
* Prices with asterisk are net prices excl. statutory VAT.
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