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Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm


Quantity:  pieces  
Product information

Item number:
     5070-374424B60023G
Manufacturer:
     BOYD CORP
Manufacturer no.:
     374424B60023G
EAN/GTIN:
     n/a
Search terms:
FPGA
Field-programmable gate array
Heatsink
Heatsinks
Manufacturer: BOYD CORP
Colour: black
Width: 27mm
Material: aluminium
Height: 18mm
Length: 27mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Unit price: No
#Promotion: aac_202202
An overview of the conditions1
Delivery period
Stock level
Price
from £ 2.74*
  
Price is valid from 432 pieces
Minimum order quantity: 216 pieces
Select conditions yourself
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Staggered prices
Order quantity
Net
Gross
Unit
from 216 pieces
£ 2.79*
£ 3.35
per piece
from 432 pieces
£ 2.74*
£ 3.29
per piece
* Prices with asterisk are net prices excl. statutory VAT.
Our offer is only aimed at companies, public institutions and freelancers.