Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm purchased inexpensively from Mercateo

Product information

Item number:
5070-375224B00032G

Manufacturer:
BOYD CORP

Manufacturer no.:
375224B00032G

EAN/GTIN:
n/a

Search terms:

FPGA
Field-programmable gate array
Heatsink
Heatsinks

Manufacturer: BOYD CORP
Colour: black
Width: 10.2mm
Material: aluminium
Height: 10.2mm
Length: 11.1mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Unit price: No
#Promotion: aac_202202

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Other search terms: Heat sink, Heat sinks, SMD heatsink, SMD heatsinks, Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks