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| Item number: CIEN3-74285694 Manufacturer no.: 51645 EAN/GTIN: n/a |
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![](/p.gif) | Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties. More information: Features | Thermal conductivity | 3.17 W/m·K | ![](/p.gif) | Product colour | Silver | ![](/p.gif) | Thermal resistance | 0.067 °C/W | Weight & dimensions | Weight | 1 g |
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![](/p.gif) | Other search terms: thermal compound, thermal grease, thermal greases, heat sink compound, heat sink compounds |
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